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Flexible Printed Circuit (FPC)
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Keywords:
Amphenol
Product Description
Flexible Printed circuits consist of patterned conductive layers made of copper foil and dielectric insulating layers that are laminated together and may be populated with components
FEATURES:
Reduce Packaging Size& Increase Reliability
Repeatable process eliminates wiring labor, assembly errors
Minimize weight & Maximize component Areas
Streamline Mechanical & Electrical Design.
Increase Flexibility in performance & packaging
Operation temperature : -45 to 200
Layer count :1 to 16
Vibration resistant and chemistry resistant
Signal shielding is available
Various surface treatment is available
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Contact Us
Fax : 86-20-3483 9800
E-mail : cs@amphenol-gasf.com
Add : #A WanAn Ind. Park, LanHe Town, Nansha Dist Guangzhou, PRC 511480
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