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  Flexible circuit boards, Rigid-Flex PCB
· FPC surface treatment
· Options to add to flex circuits
·Testing capabilities
·Raw Material

Advantages and benefits:
·Replicability
–Flexible circuits are customized specifically for fixed connection point, the production of products and customer installation operations have repeatability, reproducibility, it is easy to install and reduce the cost of installation errors etc. 。
   

·Space and Weight Saving

– Contrast to the same design of the PCB or wiring harness applications, can save up to 60% of the weight and space for the end products more closely, lightweight and clean the inner connection scheme 。

   
·Anti-Vibration

–The flexibility and decreased weight allows the flex circuit to absorb and reduce impact of the vibration to itself as well as any joints associated in connection


·Bending Cycles

– FPC's own soft performance of the overall circuit three-dimensional design may reduce the unnecessary costs within the connection, while the number of bending up to 200 thousands to cycles with standard materials.

   

·Harsh environments 

– Flexible circuit materials and design with waterproof moisture-proof, shock proof oil, high temperature corrosion-resistant properties, suitable for harsh operating environment

   

Single-sided (including the hollow board)Frame
IPC 6013 Type 1


Benefits :
Flexible,
Good bending cycles,
Cost effective

   

Double-Sided Structure
IPC 6013 Type 2

Benefits :
More flexible in design
Space saving
Double-sided soldering

   

Multilayer
IPC 6013 Type 3

Benefits :
More flexible in 3 dimensional design with PTH, blind via and bury via
Enable more compact package

   

Rigid-Flex PCB– IPC 6013
Type 4

Combined with FPC and PCB advantages, rigid-flex circuits provides reliable 3 dimensional circuitry application with stable platform for stiffeners, components, heat steaks, pins and other possible value added items

   

Option to add to Flex Circuits

•  Forming – May be added to any flex circuit to have a specific shape or configuration ready upon delivery of the part ( ready for installation )
•  Fingers – Usually added single or double layer constructions. They many be supported or not, ZIF ends generally are supported
• Pins – Generally added through the addition of a stiffener for required support Crimped Pins – Available in Amp or Tyco

 

FPC surface treatment
• RoHs
• Electroplating Nickel Gold (Hard Gold & Soft Gold)
• Immersion Gold
• Pure tin plating
• Silver
• OSP
• Non RoHs
• Pb-Sn plating
• Tin Lead

Testing capabilities

• All the IPC circuit board specifications of the test
• Circuit power test circuit
• Impedance Test
• Hi Pot
• Flying Probe Test
• AOI Optical-scan test
• Environmental chamber test cycle
• Ionic Cleanliness Testing
• X-ray Metal Thickness Testing
• Bed of Nails testing

   

Functional Product Perimeters

• Layer Count

1-15

• Panel Thickness

0.003" – 0.225"

• Blind Vias Aspect Ratio

1.25 : 1

• Trough Vias

STD 7:1 ; ADV 10:1

• Lines/Spacing

0.003"/0.003"

• Min Core Thickness

0.001"

• Impedance Control

STD ±10% ; ADV ±7%

Raw Materials
• Polyimides – Flame retardant, Non Flame Retardant, Adhesiveless , PEN, PET
• Adhesive Types – ·Acrylic ,Epoxy, PSA, Fire Retardant & Non Fire Retardant
• Copper – ¼ oz thru 25oz ( ¼ thru full hard ), RA or ED & Copper Alloys
• Shielding – Copper or Silver paste and foil
• Outer Coatings – Solder mask
• Other materials and reinforcing materials – ·FR4
• GFN
• GIN

 
Copyright @ 2002-2009 Guangzhou Amphenol Sincere Flex Circuits CO ., Ltd.
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